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We are pleased to announce the
BEST PAPER CANDIDATES
featured in the EMC+SIPI 2024 Technical Program:
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EMC BEST PAPER CANDIDATES | |
Imitation Learning-Based Fast Optimization of SSD Interface for PCIe 6.0 considering Signal Integrity
Seonguk Choi1, Jihun Kim1, Taein Shin1, Jungmin Ahn1, Keunwoo Kim1, Keeyoung Son1, Joonsang Park1, Jinwook Song2, Kyungsuk Kim2, Sunghoon Chun2, Joungho Kim1
1Korea Advanced Institute of Science and Technology, Korea; 2Samsung Electronics, Korea
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Operation of the Bifilar Common-Mode Voltage Suppressor
James McLean
TDK Corp., USA
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Design of Experiment Analysis on Multiple PIM Sources in an RF Antenna System
Shengxuan Xia1, Yuchu He2, Haicheng Zhou2, Hanfeng Wang2, Chulsoon Hwang1
1Missouri University of Science and Technology, USA; 2Google Inc., USA
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Statistics of Electromagnetic Fields within Wire-Coupled, Nested Reverberant Enclosures
Marshall D. Sowell, Kyle A. Shea, Carl E. Hager IV
Naval Surface Warfare Center, USA
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On the Feasibility of a Direct Injection Probe with a Capacitively Coupled Return and Integrated Voltage Monitor
Aaron Harmon, Daniel Szanto, Victor Khilkevich, Daryl Beetner
Missouri University of Science and Technology, USA
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Switching Transient Immunity Analysis of Wireless Communication Unit in Smart Substation
Weidong Zhang
North China Electric Power University, China
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Radiated Emission Modeling of a Wireless Power Transfer System
Hanyu Zhang1, Guanghua Li2, Viswa Pilla2, Chulsoon Hwang1
1Missouri University of Science and Technology, USA; 2Apple Inc., USA
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A Model for Corona Streamer Propagation on Glass during an Air Discharge
Zhekun Peng1, Jianchi Zhou2, Darryl Kostka2, David Pommerenke3, Daryl Beetner1
1Missouri University of Science and Technology, USA; 2Apple Inc., USA; 3Technische Universitat Graz, Austria
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Full Modal-Admittance Matrix In-Circuit Measurement by Multiple Inductive Probes
Simone Negri, Giordano Spadacini, Flavia Grassi, Sergio A. Pignari
Politecnico di Milano, Italy
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A Fast Metalearning Algorithm for Neural Network Enabled Uncertainty Quantification of Graphene based Interconnects with Passive Shielding
Asha Kumari Jakhar, Dyuti Basu, Km Dimple, Surila Guglani, Avirup Dasgupta, Sourajeet Roy
Indian Institute of Technology Roorkee, India
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Estimating Effects of Residual Physics with Machine Learning for Earbud Performance Prediction
Srinivasa Mohan1, Jingchen Liang1, Mingfeng Xue2, Krishna Mellachervu1, Pavani Gottipati1, Jianmin Zhang2
1Ansys, Inc., USA; 2Google Inc., USA
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Analytical Solution of the Lightning Transmission Line (TL) Model, at the Speed of Light
Nathan S. Roberts
NASA Johnson Space Center, USA
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Fusion of Parameterized and Physics-Oriented Statistical Surrogate Models for EM Coupling on Wires in Complex Electronic Enclosures
Shen Lin1, Sangrui Luo1, Yang Shao1, Zhen Peng1, Bisrat D. Addissie2, Zachary B. Drikas2
1University of Illinois at Urbana-Champaign, USA; 2U.S. Naval Research Laboratory, USA
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SIPI BEST PAPER CANDIDATES | |
Reducing EMI in Wire-Bond BGA IC-Chips through Magnetic Dipole Moment Control
Satoshi Tago, Keita Sasaki, Yasuhiro Ochiai
Sony Semiconductor Solutions Corporation, Japan
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Novel Interdigital Capacitor-Type Power Distribution Network Design for Power Noise Suppression in Redistribution Layer Interposer
Haojie Wu1, Xinglin Sun2, Keeyoung Son2, Jonghyun Hong2, Yin Sun3, Joungho Kim2
1Zhejiang University, China; 2Korea Advanced Institute of Science and Technology, Korea; 3Ningbo Detool Technology Co. Ltd, China
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Behavior Model of a Multiphase Voltage Regulator Module with Rapid Voltage Drop Protection
Junho Joo1, Hanyu Zhang1, Hanfeng Wang2, Wei Shen2, Zhigang Liang2, Lihui Cao2, Seungtaek Jeong2, Chulsoon Hwang1
1Missouri University of Science and Technology, USA; 2Google Inc., USA
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Reinforcement Learning-Based Power/Ground Ball Map Design Optimization for Multi-Power Domain in 3D-ICs Package
Seunghun Ryu, Dongryul Park, Hyunwoong Kim, Seonghi Lee, Sanguk Lee, Seungyoung Ahn
Korea Advanced Institute of Science and Technology, Korea
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DB-KBNN based Approach for PSIJ Analysis with a Comparative Study of Energy Models
Ahsan Javaid1, Ramachandra Achar1, Jai Narayan Tripathi2
1Carleton University, Canada; 2Indian Institute of Technology Jodhpur, India
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VIEW THE UPDATED ADVANCE PROGRAM | |
Updates Include:
- Boeing Technical Tour
- ANSI C63.4 and C63.25 Workshop
- Welcome Reception and Evening Gala Details
- New Exhibitors!
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