Today’s dynamic global security threats require solutions both big and small – solutions living within the Northrop Grumman Microelectronics Center. A radar system which once required about eight transmit-receive modules for certain functions, each the size of a stick of gum, now is made possible with one tiny chip measuring less than a square inch. This is just one example living across the hundreds of systems leveraging microelectronics. Our quests to cut down on data loss, reduce size weight and power and the ability to provide a broader variety of materials for overall survivability have been accomplished because of the technological might of this center.  

“The advanced computing center of the world is not in Silicon Valley, it’s right here in our foundries because of the advanced technologies we are working on,” said Vern Boyle, sector vice president, Northrop Grumman Microelectronics Center. “We are in the process of providing access to our microelectronics product lines to defense and commercials industries. Forward-thinking technologies, developed at Northrop Grumman ahead of their needed mission, is what sets this business apart.”

Northrop Grumman’s secure microelectronics facilities produce millions of microchips a year, with the tailored design, fabrication and packaging needed to address the high mix of our nation’s most advanced defense systems and sensors. (Photo Credit: Northrop Grumman)

Hundreds of programs, from under the sea to space, are carrying microelectronics components designed and developed within Northrop Grumman Microelectronics Center facilities. From satellites and telescopes currently in orbit, to radars used in combat today by warfighters, all have building blocks within, born out of the innovation linked to the Microelectronics Center.

“We keep out-inventing ourselves,” said Matt Hicks, director of the Advanced Technology Lab, one of Northrop Grumman’s foundries. “We’re pushing the boundaries of what physics and chemistry allow for our next-generation systems.”

From then to now

Initiatives used in Northrop Grumman foundries helped the United States level the playing field in semiconductor fabrication using silicon technology. Still, other engineering efforts assisted in the creation of compound devices like GaN semiconductors and the Super-Lattice Castellated Field Effect Transistor (SLCFET). All of these links back to Northop Grumman’s decades of expertise in designing advanced microelectronics solutions for warfighters’ needs.

With current programs, the Northrop Grumman Microelectronics Center is testing and perfecting transistor technology, working across the defense industrial base to develop key concepts that will be integrated into successful systems. “Companies in the defense industry are working to create the very best microelectronics solutions for systems and platforms to deliver success for the warfighter time and time again,” said Ben Heying, director of microelectronics at Northrop Grumman’s Space Park foundry.

Differentiating microelectronics teams are pioneering technological solutions in Northrop Grumman’s accredited foundries. (Photo Credit: Northrop Grumman)

For future missions, microelectronics expertise is critical to developing emerging capabilities. Our knowledge and trusted solutions continue to drive us forward as we develop Radio Frequency and Electro-Optical/Infrared devices while also perfecting thermal management and processing. “We will leverage our knowledge of properties for new ultrawide bandgap materials to develop devices capable of producing surface-of-the-sun power densities, breaking down the roadblocks that limit electrical performance today" said Josei Chang, director of advanced electronics in emerging capabilities development, Northrop Grumman.

Drive toward mission success

Today, Northrop Grumman’s secure microelectronics facilities produce millions of microchips a year, with the tailored design, fabrication and packaging needed to address the high mix of our nation’s most advanced defense systems and sensors. Northrop Grumman continues building on successful internal fabrication and packaging, most recently including a major capability and capacity expansion of our proven wafer post-processing facility in Florida, planning to more than triple volume. Northrop Grumman’s Microelectronics Center is defining possible every day. What comes next is immeasurable.